Upcoming Events

Inaugural seminar: "Next-Generation System Integration: Heterogeneous Integration and Hybrid Bonding for AI"

The semiconductor industry in Singapore continues to grow rapidly, yet opportunities for technical networking and knowledge sharing remain limited. To address this gap, we are launching a new initiative — a Quarterly Technical & Networking Seminar Series — designed to serve as a platform for the local semiconductor ecosystem to exchange insights, share innovations, and foster collaboration.

Our inaugural seminar will focus on the theme:

"Next-Generation System Integration: Heterogeneous Integration and Hybrid Bonding for Al"

— key technologies driving the next generation of advanced packaging and system integration.

The accelerating growth of Artificial Intelligence and its transformative applications, from large language models to complex autonomous systems, is rapidly driving the demand for unprecedented computational power. This surging demand, however, is increasingly bottlenecked by the constraints of traditional monolithic chip architectures and their limitations on data transmission and power efficiency. This seminar explores how Heterogeneous Integration (HI) provides the necessary architectural solution, with Hybrid Bonding serving as the revolutionary interconnect that achieves ultra-fine pitch, high-density, and high-speed links. Join us to learn from industry leaders to collaboratively shape the next generation of semiconductor technology.

This program gathers industry luminaries and technical experts to explore cutting-edge advancements in heterogeneous integration (HI) and map the future of HI direction in semiconductor packaging. Beyond the technical sessions, this event also provides a networking opportunity to connect with industry peers as we come together to welcome and celebrate the year 2026.

We look forward to your participation and support in making this inaugural event a success, and to building a stronger, more connected semiconductor community in Singapore.

Date: 7 Jan 2026

Venue: 230 Victoria Street, #04-09/10,Bugis Junction Towers, S188024

Time: 1400-1800

Please complete the registration form to secure your spot at

https://docs.google.com/forms/d/1827Cc13I-bMpYbCBttuvOa9diMEqwf6Rv33uGLzIiSs/edit

A limited number of 3 sponsorships slots to grab if you're interested in showcasing your organization,

please contact us leetk@launchxtec.com to reserve your space.