Upcoming Workshops (Malaysia)

Interconnect Solutions for Chiplet and Heterogeneous Integration: Flip Chip, Thermocompression, and Hybrid Bonding (21-22 Sep)

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Advance your understanding of next-generation semiconductor packaging with this comprehensive workshop on interconnect technologies. Beginning with the fundamentals of packaging performance and reliability, the program explores mechanical, thermal, electrical, and chemical design factors, as well as heterogeneous integration architectures such as SoC, SiP, and chiplets.

Participants will gain in-depth knowledge of key bonding technologies—including Flip Chip (C4 and thermocompression), Thermocompression Bonding for fine-pitch applications, and Hybrid Bonding for sub-10 µm interconnects. Through detailed process insights, design considerations, and material innovations, this workshop equips engineers with the technical expertise to enhance performance, yield, and scalability in advanced packaging systems.

Chiplet & Heterogeneous Integration for Advanced Packaging

(15-16 Oct)

This comprehensive program covers the evolution from traditional IC packaging to chiplet-based and heterogeneous integration architectures, highlighting the market trends and technology drivers shaping modern electronics. Participants will delve into IC carriers and substrates as the foundation of multi-chip integration, gain hands-on understanding of 3D packaging and TSV processes for vertical stacking, and examine cutting-edge fan-out and panel-level packaging solutions.

The workshop concludes with an exploration of emerging technologies—including hybrid bonding, glass core substrates, and advanced substrate architectures (2.1D–3.5D)—that are redefining performance, scalability, and design flexibility in semiconductor systems.

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System-in-Package Assembly for High-Performance and Heterogeneous Integration

(23-24 Nov)

Glass Core Substrates for Advanced Packaging: Materials, Processes, and Integration

(10-11 Dec)

This workshop delivers a comprehensive introduction to System-in-Package (SiP) technology, beginning with the role of IC packaging in enabling compact, high-performance, and application-driven electronic systems and comparing SiP and SoC approaches across wireless, computing, power, and automotive markets. Participants gain a solid foundation in thermal and electrical management, covering heat transfer, thermal modeling, signal integrity, EMI, and noise mechanisms critical to reliable high-speed designs, followed by detailed coverage of interconnect technologies, board-level assembly, and soldering with emphasis on Pb-free materials and reliability.

The program concludes with an in-depth review of SiP assembly processes—from wafer thinning and die attach to encapsulation, plating, and trim-and-form—providing a holistic view of manufacturing flow and reliability considerations. This workshop is tailored to help engineers quickly get up to speed on the latest assembly technologies, materials, and industry best practices.

Discover how glass substrates are redefining the future of advanced semiconductor packaging in this comprehensive workshop. Learn why glass is emerging as a superior alternative to silicon and organic materials, offering unmatched dimensional stability, low dielectric loss, and high flatness.

The program covers material and performance advantages, key design rules, and fabrication processes such as through-glass via (TGV) formation, metallization, and redistribution layers. Participants will explore diverse applications—from HPC and AI accelerators to RF and photonics—along with insights into reliability testing, manufacturing challenges, and the evolving global supply chain.

The workshop concludes with a forward-looking view on research directions, scalability, and the role of glass substrates in next-generation 3D and chiplet-based integration.

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For more details of the workshops, pls sent email to sales@innocore-solutions.com

Venue: Amari SPICE Penang 2, Persiaran Mahsuri, Bayan Baru, 11900 Bayan Lepas, Pulau Pinang, Malaysia

Please request a quotation by emailing sales@innocore-solutions.com or proceed with registration and we will contact you.

Registration

All above workshops are HRD corp funded

Reach out to discuss your semiconductor needs.